CERAMIC CHIP CAPACITOR, 0.1 uF, 25V,MULTI LAYER CERAMIC CAPACITOR, 2.2nF, 0402,CAPACITOR, SMD,1 uF, 16V,CAPACITOR,CERAMIC CHIP MULTILAYER 1000pF, 50V,,CAPACITOR, SMD 1000 Pf, X7R, 1KV, SIZE 1206,CAPACITOR,CERAMIC CHIP MULTILAYER 0.1uF, 50V,Chip capacitor, SMD 1 uF, 50 V, X7R 1812 size,CAPACITOR, SMD, 10uF 50V, 1206,CAPACITOR,FXD.CERAMIC CHIP,22000pF,CAPACITOR,CERAMIC CHIP, 0.33uf,CAPACITOR, TANTALUM SOLID ELECTROLYTIC SMD 10 uF , 16 V,CAPACITOR,TANTALUM SOLID ELECTROLYTIC SMD, 4.7uF,CAPACITOR, FIXED METALLIZED POLY PROPYLENE, BOX TYPE RADIAL LEADS, 0.33 uF,SNAP-IN TYPE ELECTROLYTIC CAPACITOR,100uF,450V,CAPACITOR,FXD.METALLISED POLYESTER BOX TYPE,0.001MFD,1000V,CAPACITOR,FXD.CERAMIC DISC,AC,2200pF,250V AC,CAPACITOR, SMD, 10 uF, 10V,CAPACITOR, CER, 0.1 Uf,,CAPACITOR, SMD,0.047 uF,CAPACITOR, SMD, 2.2 uF, 10V, 0402,CAPACITOR, SMD, 4.7uF, 10V, 0402,CAPACITOR, SMD, 18 pF, 50V, 0402,CAPACITOR, SMD, MLCC, 12 Pf, 50V, 0402,CAPACITOR, THROGH HOLE, RADIAL LEAD TYPE CONDUCTIVE POLYMER ALUMINUM,CAP
Ministry of Communications › Department of Telecommunications (DOT)
GeMGovernment e-Marketplace (GeM)GeMClosed
| Organisation | Ministry of Communications |
|---|---|
| Department | Department of Telecommunications (DOT) |
| Tender value | Not stated by the portal |
| EMD | Not stated by the portal |
| Last date for bids | 07 Nov 2026, 10:30 pm (closed) |
| Published | 17 Oct 2026 |
| Tender type | Bid |
| Category | GeM / CERAMIC CHIP CAPACITOR, 0.1 uF, 25V,MULTI LAYER CERAMIC CAPACITOR, 2.2nF, 0402,CAPACITOR, SMD,1 uF, |
| Source | Government e-Marketplace (GeM) |
Scope of work
CERAMIC CHIP CAPACITOR, 0.1 uF, 25V,MULTI LAYER CERAMIC CAPACITOR, 2.2nF, 0402,CAPACITOR, SMD,1 uF, 16V,CAPACITOR,CERAMIC CHIP MULTILAYER 1000pF, 50V,,CAPACITOR, SMD 1000 Pf, X7R, 1KV, SIZE 1206,CAPACITOR,CERAMIC CHIP MULTILAYER 0.1uF, 50V,Chip capacitor, SMD 1 uF, 50 V, X7R 1812 size,CAPACITOR, SMD, 10uF 50V, 1206,CAPACITOR,FXD.CERAMIC CHIP,22000pF,CAPACITOR,CERAMIC CHIP, 0.33uf,CAPACITOR, TANTALUM SOLID ELECTROLYTIC SMD 10 uF , 16 V,CAPACITOR,TANTALUM SOLID ELECTROLYTIC SMD, 4.7uF,CAPACITOR, FIXED METALLIZED POLY PROPYLENE, BOX TYPE RADIAL LEADS, 0.33 uF,SNAP-IN TYPE ELECTROLYTIC CAPACITOR,100uF,450V,CAPACITOR,FXD.METALLISED POLYESTER BOX TYPE,0.001MFD,1000V,CAPACITOR,FXD.CERAMIC DISC,AC,2200pF,250V AC,CAPACITOR, SMD, 10 uF, 10V,CAPACITOR, CER, 0.1 Uf,,CAPACITOR, SMD,0.047 uF,CAPACITOR, SMD, 2.2 uF, 10V, 0402,CAPACITOR, SMD, 4.7uF, 10V, 0402,CAPACITOR, SMD, 18 pF, 50V, 0402,CAPACITOR, SMD, MLCC, 12 Pf, 50V, 0402,CAPACITOR, THROGH HOLE, RADIAL LEAD TYPE CONDUCTIVE POLYMER ALUMINUM,CAPACITOR, SMD, 100 uF, 10,
Tender ID / NIT, tender fee, inviting authority, contacts, documents and the portal link are for businesses onboarded on QuantProc Sourcing (free).
More tenders from Ministry of Communications
- Closed Body LCV Truck; One CNG Commercial Vehicle Having loading capacity 1 Ton or more with space at least 6 cubic meter volumeMinistry of Communications · closes 10 Nov 2026
- Roller Container (V2)Ministry of Communications · closes 10 Nov 2026
- as per the SOW; as per SOW; Buyer premises (onsite)Ministry of Communications · closes 11 Nov 2026
- Custom Bid for Services - PLB Pipe Duct Laying by Open Trench Method Trenchless Technology HDD Optical Fiber Cable Pulling Blowing…Ministry of Communications · closes 11 Nov 2026
- Custom Bid for Services - E-Tender for Rehabilitation, Up-gradation and OFC laying along with associated works in spans of areas under…Ministry of Communications · closes 11 Nov 2026
- Maintenance of OFC routes, Media Equipment, BTS, Tower, Power Equipment and Infrastructure in J..Ministry of Communications · closes 11 Nov 2026
- High End Laptop - NotebookMinistry of Communications · closes 11 Nov 2026
- Operation and ..Ministry of Communications · closes 11 Nov 2026